Epson is optimistic about the handheld embedded device sensing market
mcu+ sensor to create a complete scheme. Epson is optimistic about the handheld embedded device sensing market
Epson, which is famous for low-power components, is trying to seize the huge market opportunity brought by the massive demand for wireless sensing technology in the handheld embedded device market. Following the launch last year of the new generation of 16 bit MCU s1c17 series for sensor control, which boasts both the low-power characteristics of 8-bit MCU and the high-performance advantages of 32-bit MCU, and the launch of the supporting development platform for wireless sensor applications, c17star, the company announced not long ago, Together with BOSC control mode, a major manufacturer of MEMS sensors, and two partners of intelligent expert setting system hsensortec and ZigBee solution supplier ceramicro, we launched the "Epson C17 electronic creativity competition", hoping to stimulate more and more creative system level sensors and wireless technology applications through the combination of the three technologies
s1c17: MCU specially designed for handheld embedded wireless sensor control
"wireless communication and sensor applications are becoming a new development direction of embedded applications." Chengweimin, senior sales manager of Epson, said, "various applications for personal health/entertainment, safety and industrial control are increasingly using wireless sensor technology to improve performance and use experience. S1c17 series is designed for this demand."
according to Cheng Weimin's introduction, s1c17 is definitely tailored for the above market - in addition to the 16 bit CPU core, which can meet the various requirements of the sensor's complex algorithms and wireless communication protocols in embedded applications in terms of computing power, Epson's unique low-power technology also makes this product particularly suitable for battery powered wireless sensor embedded application systems, In addition, in order to connect various types of sensors and wireless communication modules, designers also built a variety of rich peripheral interfaces for it
however, for an excellent embedded wireless sensor controller whose accuracy is ± 0.02%, the above advantages seem to be insufficient. Therefore, Epson especially introduces a high-performance RISC instruction architecture and an optimized instruction set for C language development, which greatly reduces the complexity of the development work. In addition to the built-in flashrom, Epson also provides customers with the factory writing service of flashrom, so that the latter can put the terminal into the market before its competitors
it must also be mentioned that a complete development system is crucial in today's highly competitive semiconductor market. Cheng Weimin said that in addition to the chip itself, Epson also provides engineers with a miniaturized and low-cost simulator icdmini and an integrated compilation simulation software package gnu17. In addition, there are development boards for various applications, striving to create a friendly and efficient development environment. For example, the c17star development board used in this competition not only supports liquid crystal display, PWM pronunciation and single battery power supply, but also is equipped with a/d, I2C, UART, RF and other interfaces to support various peripherals. In particular, in order to facilitate the development of wireless sensor applications and users, c17star also provides sensor expansion interfaces and wireless expansion interfaces. Among them, the sensor expansion interface can support Epson's angular velocity sensor, acceleration sensor, extended temperature/humidity and other digital and analog sensors, while the wireless expansion interface can support ZigBee, Bluetooth, 2.4GHz and other wireless communications
s1c17 Series MCU has been released for nearly a year. Epson has successively launched multiple series of s1c1716 bit MCU with C17 core. It includes c178 series with built-in LCD controller, standard c175 series, s1c177 series with built-in dot matrix LCD driver, s1c176 series with built-in segment code LCD driver, and s1c170 series for special applications
join hands with boschsensortec and ceramic micro technology
unlike most competitions, which are based on the products of a single company, players in this competition can use Epson's s1c17 Series MCU and c17star platform, as well as boschsensortec's sensors and ZigBee solutions from Taiwan ceramic micro technology
"although Epson also provides angular velocity sensors and acceleration sensors, Epson believes that both boschsensortec and chinamicro technology have very unique technologies. It is believed that the joint cooperation of the three companies will play a good role in promoting the technological development of the system level market." Sakai Jiahong, deputy general manager of Epson China Co., Ltd., said
indeed, Niu Li, Department Manager of Epson electronic devices business headquarters Beijing business department, explained that the company's acceleration sensors are mainly based on crystal materials, while boschsensortec is a silicon sensor based on MEMS technology, so the two sides are more complementary to each other. In addition, MEMS sensors have been rapidly and large-scale applied in consumer electronics but not limited to this field in recent years. If s1c17 Series MCU can burst out different application inspiration after being combined with it, it will be a win-win situation for the two companies
when referring to boschsensortec, we must mention the Bosch process (deep reactive ion etching). It is said that the process invented by the company has become a widely used technology in the MEMS industry. "We have more than 800 patents in the MEMS field, and we are also the winner of the 2007 European Innovation Award." Zheng Guanhong, a senior sales engineer of boschsensortec, said, "as a pioneer in the MEMS field, Bosch, the parent company of boschsensortec, has more than 20 years of industry experience here. So far, Bosch has shipped more than one billion MEMS chips. However, most of them are mainly concentrated in automotive electronics. In the future, we hope that boschsensortec for consumer electronics applications can also sell more and more chips."
it is reported that boschsensortec provides pressure sensors and acceleration sensors at the same time, but the latter is the main part of this competition. In this regard, it is particularly worth mentioning that the company has left its competitors far behind in terms of the size of MEMS sensors. "When the company was founded in 2005, the size of our acceleration sensor was 6x6mm, but in 2007, we launched the world's first 3x3mm MEMS sensor. It was not until a year later that other companies launched the same product." Zheng Guanhong said. It is said that the company will launch MEMS acceleration sensors with a surface size of only 2x2mm this year
in addition to Epson's MCU, angular velocity sensor and boschsensortec's MEMS acceleration sensor, the contestants of this competition will also be lucky to adopt ZigBee wireless chip provided by China micro technology
chinamicro technology, established in Taiwan in 2003, this special introduction is the ezigbee chip level module czip-e01, which integrates MCU, crystal oscillator and RF modules in cooperation with Epson. Zeng Minghuang, general manager of the company, said that although in the long run, ZigBee can be applied to various fields. However, a major problem is that most of the manufacturers in these fields have never even involved ZigBee. In addition, the current scheme still has the problem of too high cost. The ezigbee solution of China micro technology uses one chip to solve the cost problem. As for the application, the company will continue to launch a series of SIP for various applications. As for why he chose the company's MCU kernel for integration with Epson, he admitted that he was interested in the latter's low-power and high-performance features
"start a business after winning the bonus"
at present, this competition is still relatively popular. Although the news about the event was just released in early September, Niu Li said that someone had submitted his plan a few days later. He said that on the one hand, this may be because the competition focuses on creativity rather than realization, so the entry threshold is relatively low. On the other hand, in addition to the generous bonus (the maximum bonus is 10000 yuan), a "post competition unit" is also set up, that is, players are encouraged to cooperate with Epson to start a business
Niu Li introduced that the competition, which will last for two months from September 1 (ending on October 31), will be divided into two themes: "dynamic scheme" and "wireless scheme". Contestants only need to submit their ideas. It can provide various contents including application introduction, design idea, system structure and hardware block diagram, software block diagram, scheme feature analysis, application market prospect, etc. However, the s1c17 Series MCU involving Epson is limited to the four models of s1c17501, s1c17602, s1c17705 and s1c17801
the "post competition unit" to be introduced in particular will begin in December this year. Niu Li said that for the winners of the best scheme award and excellent award, Epson will discuss the actual development and promotion of the scheme with the winners according to their wishes, and share the benefits of the project together. This is indeed a good opportunity for those engineers who have entrepreneurial dreams and whose metal recovery rate can reach more than 97%